Asia Pacific Wi-Fi Chipset Market Growth and Size, Rising Trends, Demand, Revenue, Key Manufacturers, Challenges, Business Opportunities and Forecast Analysis Till 2033: SPER Market Research

Asia Pacific Wi-Fi Chipset Market

Wi-Fi chipsets are system-on-chip (SoC) or hardware communication modules that allow devices to communicate wirelessly. Wireless (Wi-Fi) chipsets are commonly found in hardware components such as external wireless local area network (WLAN) cards and WLAN adapters. Furthermore, Wi-Fi chipsets are widely used in a number of devices, including laptops, personal computers, and cellphones. Wi-Fi chipsets usually offer three operational bands: single, dual, and triband.

According to SPER market research, ‘Asia Pacific Wi-Fi Chipset Market Size – By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User – Regional Outlook, Competitive Strategies and Segment Forecast to 2033’ state that the Asia Pacific Wi-Fi Chipset Market is predicted to reach USD 8919.14 million by 2033 with a CAGR of 3.45%.

Drivers:

The expanding acceptance of IoT, rising globalisation, and the growing number of public Wi-Fi hotspots around the world will all serve as major market growth drivers. Furthermore, the growing number of small-scale businesses looking to deploy high-speed network access, as well as the increasing penetration of consumer electronic devices like smartphones, laptops, and others, will erode market value. Wi-Fi technology has gained in popularity as smartphones become more widely used around the world. Customers choose Voice-Over Mobile Broadband (VOMBB) over traditional telecom carriers because to its superior audio quality, low cost, and ability to conserve power, hence increasing demand for Wi-Fi services.

Challenges:

Even with the overall growth of the consumer electronics sector, the improved performance of phablets and falling smartphone prices are expected to have a significant influence on the shipment of PCs and tablets. The increased quantity of smartphone shipments in this region is primarily attributable to China’s low-cost smartphone manufacturing. Consumers in Asia Pacific’s growing nations who are budget conscious prefer phablets to expensive tablets. In addition, tablets and PCs require more frequent replacements than cellphones. As a result, the PC and tablet markets are expanding less.

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The outbreak has prompted the market to experience unprecedented changes. It has impeded firm operations and disrupted supply chains due to a lack of raw materials and labour. Furthermore, the temporary closure of electronic retail establishments has slowed the sale of new Wi-Fi 6 devices, affecting the Wi-Fi chipset market. Furthermore, due to short-term production shutdowns, supply chain interruptions, and a lack of linked product availability, the IoT connection market is predicted to experience an 18% decrease in net device additions in 2020. As a result, Wi-Fi 5 remains the market leader, with Wi-Fi 6 not expected to replace it for another 4-5 years.

China dominates the Asia-Pacific Wi-Fi chipset market and is the fastest developing country due to the low cost of Wi-Fi chip manufacturing and the huge number of consumer electronics players in the region. Furthermore, Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO, LTD, Broadcom, Hitachi, and Others are among the market’s main companies.

Asia Pacific Wi-Fi Chipset Market Segmentation:

By Device: Based on the Device, Asia Pacific Wi-Fi Chipset Market is segmented as; Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others.

By Band: Based on the Band, Asia Pacific Wi-Fi Chipset Market is segmented as; Single Band, Dual Band, Tri Band.

By Fabrication Technology: Based on the Fabrication Technology, Asia Pacific Wi-Fi Chipset Market is segmented as; FinFET, FDSOI CMOS, Silicon on Insulator, Sige.

By Wi-Fi Standard: Based on the Wi-Fi Standard, Asia Pacific Wi-Fi Chipset Market is segmented as; 802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others.

By MIMO Configuration: Based on the MIMO Configuration, Asia Pacific Wi-Fi Chipset Market is segmented as; MU-MIMO, 4×4 MU-MIMO, 8×8 MU-MIMO, SU-MIMO, 3×3 MU-MIMO, 2×2 MU-MIMO, 1×1 MU-MIMO.

By End User: Based on the End User, Asia Pacific Wi-Fi Chipset Market is segmented as; Consumer, Automotive and Transportation, Healthcare, Education, BFSI, Travel and Hospitality, Others.

By Region: This research includes data for China, Japan, India, South Korea, Australia, Indonesia, Others.

For More Information, refer to below link: –

APAC Wi-Fi Chipset Market  Outlook

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